Reactive NanoTechnologies, Inc.
180 Lake Front Drive
Hunt Valley, MD 21030
Phone: 410-771-9801
Fax: 410-771-0586

Thermal Management

Glossary | General Library | Sputter Target Library | Electronics Assembly Library | Thermal Management Library | Energetics, Joining Development Library |
RoHS Compliance

IPACK - Comparison of Thermal Performance of Current High-end. July 2007
Test Report - Reliablity Test Results for Nano-Bond Thermal Interface Solutions August 2007
NanoBond® Thermal Interface Product Sheet - August 2007
Heat Sinks Reactively Soldered to ICs - DesignCon East, Boxborough, MA April 5, 2004
A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting - IMAPS Symposium, Boston, MA November 16-20 2003
Direct Die Attach With Indium Using a Room Temperature Soldering Process - IMAPS Symposium, Long Beach, CA November 14-18, 2004
Enhanced thermal performance by direct solder attach of silicon dies - IMAPS ATW October, 1 2004, Hunt Valley, MD
Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance - ITHERM Conference, Las Vegas, NV June 1-4, 2004
Thermal Behavior of a Soldered Cu-Si Interface Semi-Therm, Boston, MA March 9-11, 2004