Technology Papers

  1. Modeling and characterizing the propagation velocity of exothermic reactions in multilayer foils - Journal of Applied Physics
    August 1, 1997
  2. Effect of intermixing on self-propagating exothermic reactions in Al/Ni nanolaminate foils - Journal of Applied Physics
    February 1, 2000
  3. Effect of reactant and product melting on self-propagating reactions in multilayer foils - Journal of Applied Physics
    November 1, 2002
  4. Joining of stainless-steel specimens with nanostructured Al/Ni foils - Journal of Applied Physics
    January 1, 2004

    5. Thermal Management

    1. Heat Sinks Reactively Soldered to ICs - DesignCon East, Boxborough, MA
      April 5, 2004
    2. A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting - IMAPS Symposium, Boston, Massachussettes
      November 16-20 2003
    3. Direct Die Attach With Indium Using a Room Temperature Soldering Process - IMAPS Symposium, Long Beach, CA
      November 14-18, 2004
    4. Enhanced thermal performance by direct solder attach of silicon dies - IMAPS ATW
      October, 1 2004
    5. Room Temperature Soldering of Microelectronic Components for Enhanced Thermal Performance - ITHERM Conference, Las Vegas, Nevada
      June 1-4, 2004
    6. Thermal Behavior of a Soldered Cu-Si Interface Semi-Therm, Boston, Massachussettes
      March 9-11, 2004

    Component Mounting

    1. Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source - ASM Materials Solutions Conference & Show, Columbus, Ohio
      October 18-20, 2004
    2. Room Temperature Soldering of Connectors to PCB Using Reactive Multilayer Foils - IMAPS Symposium, Philadelphia, Pennsylvania
      September 25-29, 2005
    3. Hermetic Sealing of Microelectronics Packages Using a Room Temperature Soldering Process - IMAPS Symposium, Philadelphia, Pennsylvania
      September 25-29, 2005
    4. Mounting of Microelectronic Components at Room Temperature with Solders and Local Heat Sources - IMAPS Packaging
      October 22, 2003
    5. Room Temperature Hermetic Sealing of Microelectronic Packages with Nanoscale Multilayer Reactive Foils - The Minerals, Metals & Materials Society Conference, Pittsburgh, Pennsylvania
      September 25, 2005

    Joining

    1. Metallic Bonding of Ceramic Armor using Reactive Multilayer Foils - American Ceramic Society Meeting, Cocoa Beach, Florida
      January 25-30, 2004
    2. Characterization of Room Temperature Solder Joints Using Scanning Acoustic Microscopy - IMAPS Symposium, Philadelphia, Pennsylvania
      September 25-29, 2005
Reactive NanoTechnologies, Inc.
Address
111 Lake Front Dr.
Hunt Valley, MD 21030
Contact Info
Phone: 410-771-9801
Fax: 410-771-0586