Process Modeling Technology
One of the most important developments of this technology is the ability to accurately predict the temperature profile on the various components when used in a joining application. The scientists at RNT have built a numerical model based on a simplified description of the self-propagating reaction of the foil. The model effectively simulates heat flow into the solder layers and temperature evolution over time within the bonded components. Utilizing this tool, our engineers can reliably design the material set to ensure optimum performance of the NanoBond® joining process.
Reactive NanoTechnologies, Inc.
- Address
- 111 Lake Front Dr.
- Hunt Valley, MD 21030
- Contact Info
- Phone: 410-771-9801
- Fax: 410-771-0586