Electronics Assembly
Glossary | General Library | Sputter Target Library | Electronics Assembly Library | Thermal Management Library | Energetics, Joining Development Library
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Surface Mounting LEDs with NanoBond- The Joining Process Using NanoFoil® - May 2008 |
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Preliminary Test Report Comparing the Thermal Performance of NanoBond® to that of a Thermal Epoxy in an LED Thermal - Interconnect Application- June 2008 |
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Test Report- Reliability Test Results on LED Attach with NanoBond® - May 2008 |
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Room Temperature Lead-Free Soldering of Microelectronic Components using a Local Heat Source - ASM Materials Solutions Conference & Show, Columbus, OH
October 18-20, 2004 |
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Room Temperature Soldering of Connectors to PCB Using Reactive Multilayer Foils - IMAPS Symposium, Philadelphia, PA September 25-29, 2005 |
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Hermetic Sealing of Microelectronics Packages Using a Room Temperature Soldering Process - IMAPS Symposium, Philadelphia, PA
September 25-29, 2005 |
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Mounting of Microelectronic Components at Room Temperature with Solders and Local Heat Sources - IMAPS Packaging
Hunt Valley, MD October 22, 2003 |
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Room Temperature Hermetic Sealing of Microelectronic Packages with Nanoscale Multilayer Reactive Foils - The Minerals, Metals & Materials Society Conference, Pittsburgh, PA
September 25, 2005 |