HUNT VALLEY, MD – April 28, 2009 – Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of its patented NanoFoil®, today announced that Thermal Conductive Bonding, Inc. (TCB) a provider of bonding services including the bonding of sputter target assemblies, has entered into a license agreement for the use of RNT’s NanoFoil® and NanoBond® technologies. TCB will capitalize its bonding facilities in San Jose, CA, Allersburg, Germany, and Siheung-Si, Gyeonggi-Do, Korea to bond sputter targets using RNT’s patented room temperature bonding technique. NanoBond® is used to bond sputter targets with the additional benefits of minimizing the CTE mismatch of target and backing plate materials, improving the overall performance of target assemblies in use, and providing a more environmentally-friendly process solution.
“We are excited to welcome TCB to RNT’s family of licensees,” stated RNT’s CEO, Joseph Gryzb. “TCB is the leader in contract bonding services and are focused on several growth markets such as solar, optical coatings, and displays where the benefits of NanoBond® can be readily demonstrated.”
“We very much welcome the addition of RNT’s NanoBond® into the arsenal of bonding techniques and approaches that TCB has developed over the 11 years we have been in business,” stated President and CEO for TCB, Wayne Simpson. “TCB sees the use of RNT NanoBond® as being a valuable bonding approach that will, very well, compliment the Indium and Elastomer bonding services that TCB has become so well known for providing. As TCB introduces RNT NanoBond® to the many markets we serve, we look to RNT for a long and fruitful relationship.”
About RNT
Headquartered in Hunt Valley, Maryland, Reactive NanoTechnologies, Inc. (RNT) was founded in 2001 to develop and manufacture its patented technology, NanoFoil®.
NanoFoil® is used to precisely control the instantaneous release of heat energy for advanced joining applications providing superior performance and value to the user. The company has also developed its patented NanoBond® joining process to simplify manufacturing and ensure the benefits of NanoFoil® are maximized. NanoBond® is used today to bond sputter targets and in several electronics assembly applications including LED assembly and thermal management. Mass production of NanoFoil® is taking place from RNT’s onsite manufacturing facilities, supported by a worldwide sales, applications support, and distribution network. RNT continues to expand its customer base and has entered into licensing agreements with a number of Fortune 500 Companies. Its breakthrough technology has also earned several prestigious awards including the 2005 “R&D 100” from R&D Magazine, the 2005 Nano 50™ from NASA Nanotech Briefs Magazine and recognition in The National Nanotechnology Initiative Strategic Plan in December 2004. For more information please visit www.rntfoil.com.
About Thermal Conductive Bonding, Inc
Since 1998 TCB has provided premium quality bonding services for the high technology communities. Focus of the markets served has been for those industries using vacuum coating technology. Over the years TCB successfully developed a number of proprietary bonding techniques that uniquely address bonding issues relating to assemblies such as Sputtering Targets, Electrostatic Chucks, and Gas Dispenser Plates. In more recent years these techniques and approaches have been successfully adapted to the many variations of sputtering targets used in the Solar Industry.
Now, with many years of solid experience in joining materials, TCB continues to explorer diverse high technology applications. We continue to see expansion in the number of applications that can use our techniques and bonding materials. Capabilities include: Rotary target bonding, Indium bonding/debonding, Elastomer bonding/debonding and Solder bonding/debonding using RNT NanoBond®.
TCB is ISO 9001:2000 registered with full service facilities are located in San Jose, California, Allersburg, Germany and Siheung-Si, South Korea. For more information please visit www.tcbonding.com.