HUNT VALLEY, MD – December 16, 2008 – Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of its patented NanoFoil®, is pleased to announce that Techno Fine Co, Ltd. (TFC), a provider of bonded sputter target assemblies has passed RNT’s NanoBond® Certification Program which involves a combination of training and audits for NanoBond® licensees’ equipment, practices, and procedures.
NanoBond® is used to bond sputter targets to backing plates at room temperature, allowing the end user to enjoy higher sputter rates, improved yield and increased sputter tool uptime. The NanoBond® Certification Program creates a common process platform for NanoBond® licensees. The program assures that bond shops will offer a statistically consistent and high-yield NanoBond® process that will meet the quality needs of their customers.
“Techno Fine is a leader in bonding sputtering targets for semiconductor and LCD display applications in its facilities in Japan, Taiwan, and S. Korea,” stated RNT’s CEO, Joseph Gryzb. “We’re excited to see them complete the NanoBond® Certification Program and believe it will enhance their ability to supply high-quality, high-performing target products to their customers.”
“Techno Fine is choosing the most suitable bonding method considering material, size, quantity and cost to satisfy the market needs. Techno Fine is confident in the NanoBond® process and we’re very pleased to be the first to offer this certified process to our customers,” said Techno Fine’s President, Mr. Jun Ueno. “As the variety of materials being used to make sputter targets continues to grow and target sizes have increased, uniformity and reliability of the bond are more important than ever. Techno Fine ensures that our customers will receive the highest quality bonds possible, every time.”
About RNT
Headquartered in Hunt Valley, Maryland, Reactive NanoTechnologies, Inc. (RNT) was founded in 2001 to develop and manufacture its patented technology, NanoFoil®.
NanoFoil® is used to precisely control the instantaneous release of heat energy for advanced joining applications providing superior performance and value to the user. The company has also developed its patented NanoBond® joining process to simplify manufacturing and ensure the benefits of NanoFoil® are maximized. NanoBond® is used today to bond sputter targets and in several electronics assembly applications including LED assembly and thermal management. Mass production of NanoFoil® is taking place from RNT’s onsite manufacturing facilities, supported by a worldwide sales, applications support, and distribution network. RNT continues to expand its customer base and has entered into licensing agreements with a number of Fortune 500 Companies. Its breakthrough technology has also earned several prestigious awards including the 2005 “R&D 100” from R&D Magazine, the 2005 Nano 50™ from NASA Nanotech Briefs Magazine and recognition in The National Nanotechnology Initiative Strategic Plan in December 2004. For more information please visit www.rntfoil.com .
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