HUNT VALLEY, MD – May 12, 2009 – Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of its patented NanoFoil®, today announced that it has passed a milestone for the reliability of a concentrated photovoltaic (CPV) receiver to heat sink connection. The thermal interface connection has exceeded 1000 thermal cycles with no degradation in thermal performance or bond strength. Reliability testing on NanoBond® has shown superior thermal conductivity and mechanical integrity compared to epoxies.
RNT performed the thermal cycle testing at -40ºC to +110ºC, per IEC 62108, Test 10.6. Testing at 110ºC typically concludes at 500 cycles, but the testing was continued in order to conclusively demonstrate the superior performance of RNT’s bonding technology. Thermal conductivity was measured by laser flash technique.
“Exceeding the 1000 cycle threshold demonstrates NanoBond®‘s ability to support the 25 year life requirement that CPV systems developers seek to achieve,” stated Michael P. O’Neill, RNT’s Global Vice President of Sales. “The unique combination of high reliability and superior thermal performance is a real enabler for high concentration systems and next generation die technology.”
NanoBond® is used to bond microelectronic and photovoltaic components to PCBs or heat sinks at room temperature without the use of long cure time epoxies or solder reflow ovens, allowing the end user to enjoy higher bond coverage, better thermal performance, improved yield and lower overall process time. The NanoBond® process enables the use of higher temperature, lead-free solders creating a stronger and more reliable bond in configurations normally not suited for these solders. Problems traditionally associated with these thermal assembly applications are poor bond coverage, marginal adhesion, damage of components by reflow process, and limitations in thermal performance. These issues are significantly reduced or eliminated by the use of RNT’s NanoBond® process technology. The NanoBond® process is available for license and is currently in use to bond a variety of electronic component and assemblies, as well as to bond metal and ceramic oxide sputter targets for thin film deposition applications in North America, Europe, and Asia.
About RNT
Headquartered in Hunt Valley, Maryland, Reactive NanoTechnologies, Inc. (RNT) was founded in 2001 to develop and manufacture its patented technology, NanoFoil®.
NanoFoil® is used to precisely control the instantaneous release of heat energy for advanced joining applications providing superior performance and value to the user. The company has also developed its patented NanoBond® joining process to simplify manufacturing and ensure the benefits of NanoFoil® are maximized. NanoBond® is used today to bond sputter targets and in several electronics assembly applications including LED assembly and thermal management. Mass production of NanoFoil® is taking place from RNT’s onsite manufacturing facilities, supported by a worldwide sales, applications support, and distribution network. RNT continues to expand its customer base and has entered into licensing agreements with a number of Fortune 500 Companies. Its breakthrough technology has also earned several prestigious awards including the 2005 “R&D 100” from R&D Magazine, the 2005 Nano 50™ from NASA Nanotech Briefs Magazine and recognition in The National Nanotechnology Initiative Strategic Plan in December 2004. For more information about how to solder bond in nanoseconds, please visit www.rntfoil.com