CPV Solder Bonding Using NanoFoil^® and the NanoBond^® Process

NanoBond^®, a joining process using NanoFoil^®, can be used to replace traditional adhesives for improved thermal management at the TIM1 interface (shown below in red) in CPV receiver applications. This is accomplished by joining thick, stress-absorbing solder layers together using NanoFoil^®. The use of solder material as a replacement for traditional adhesives to bond the dissimilar materials of ceramic substrate to metal heat sinks improves thermal conductivity, provides lower junction temperatures (Tj max) resulting in improved efficiency and longer lifetime of products. As an additional benefit, NanoBond^® eliminates the need for conventional reflow limiting thermal exposure of other components in the assembly.

CPV stack up

For more information please see the application note on the NanoBond^® process and CPV attach.