Sputter Target Bonding

NanoBond^® is RNT’s patented process for joining, utilizing NanoFoil^®. This process enables high strength, high conductivity bonds between most combinations of materials making it ideal for bonding materials with large CTE mismatch, including Sputter Targets.

Electronics Assembly

NanoFoil^® also offers a localized heat source for bonding components which minimizes exposure to high process temperatures and is compatible with all solders including RoHS compliant, Pb free solders.

• CPV
• HB LED Attach
• Power Electronics
• Thermal Management
• Component Mounting

Other Applications

Taking advantage of the inherent nature of NanoFoil^®, RNT continues to develop successful energetic applications.