News / Press Releases
RNT Awarded $1.9 Million in Financing from NIST Advanced Technology Program
Hunt Valley, MD – September 16, 2003
RNT, a provider of high-tech products and solutions for component joining, has been awarded a $1.9 million grant from the National Institute of Standards and Technology’s Advanced Technology Program (ATP). The funds will be used to establish mass production manufacturing processes geared towards its launch of commercial product to broader markets.
"RNT is proud to have been selected by NIST for this award. The advances developed with this research will accelerate the mass distribution of product," said Timothy Weihs, Ph.D., RNT president and CEO. "After a rigorous review of our technology and commercialization plan, NIST determined that our solution will enable numerous industrial innovations where current joining solutions have reached their technical limit."
RNT’s new technology, expected to be commercially available early next year, is based on a foil that enables rapid joining of similar and dissimilar materials without incurring thermal damage. This technology increases productivity, reduces costs and enables product innovations while overcoming existing technical limitations and promoting the use of lead-free solders. The company will use the ATP funding award to develop methods for patterning mass quantities of foil as well as craft alternative, lower cost methods of manufacturing foil – key activities in preparation for mass product distribution.
The company is currently developing joining and component mounting technologies for the microelectronics industry. RNT is also testing and developing solutions for other applications and industries such as metal-to-metal and metal-to-ceramic joining for aerospace, defense and other industry applications.
About RNT
RNT has developed methods of soldering microelectronic devices and other components at room temperature without the use of a furnace or a torch. The NanoFoilTM product acts as a local heat source provides exactly the amount of energy needed to melt any solder or braze and join the components without heating the components themselves. This offers manufacturers the ability to decrease costs, increase productivity and enable product innovation, with or without the use of lead-based solders. Current microelectronic applications include replacing current greases, pads, and adhesives with a more conductive solder interface. These solutions also provide advances in microelectronic component mounting and other industries requiring the joining of large and small-scale ceramics and metals, such as defense and aerospace.
About the ATP
The ATP provides cost-shared funding to industry-led teams which can include non-profits and universities to help advance particularly challenging, high-risk R&D projects that have the potential to spark important, broad-based economic or social benefits for the United States. The program supports projects that industry cannot fully fund on its own because of significant technical risks. ATP awards are made on the basis of rigorous, competitive peer review of the scientific and technical merit of each proposal. The program accelerates enabling technology research, but does not support product development work. Further information about ATP is available at www.atp.nist.gov.
RNT Contact:
Caroline Worrall: 410-771-9801
cworrall@RNTfoil.com
Reactive NanoTechnologies, Inc.
- Address
- 111 Lake Front Dr.
- Hunt Valley, MD 21030
- Contact Info
- Phone: 410-771-9801
- Fax: 410-771-0586