Bonding of Sputter Targets - NanoFoil^® and Solder Selection

Applications | NanoFoil® & Solder Selection | Bonding Procedure
Performance Data | Sputter Target FAQs | Technical Library

The appropriate thickness of NanoFoil® is determined by the thermal properties of the target, backing plate and solder. Application Engineering support by RNT will advise on the appropriate NanoFoil® product. The solder selection is determined by the users' needs and wetting characteristics of the target and backing plate.

For most cases, solder from the Sn or SnAg family is recommended for its relatively high melting temperature (220°C-232°C) and superior mechanical properties. For difficult to wet target materials, including ceramics, RNT will advise on solders that have been proven effective in wetting and adhering to ceramics without the need for additional metallization.