Bonding of Sputter Targets - Bonding Procedure

Applications | NanoFoil® & Solder Selection | Bonding Procedure
Performance Data | Sputter Target FAQs | Technical Library

NanoBonding with NanoFoil® is performed in air at room temperature. The backing plate is laid flat with the pre-tinned surface up. NanoFoil® is then placed on top of this solder surface. The NanoFoil® can be in the form of a single piece for smaller sputter targets or as a pre-assembled array for larger sputter targets. The pre-tinned target is then positioned over the NanoFoil® and aligned correctly with the backing plate. A cross-section of this layout is shown schematically below.

Once the backing plate, NanoFoil® and target are correctly positioned, pressure is applied to the assembly. The reaction in the NanoFoil® is initiated by an electrical impulse (at multiple points simultaneously for large targets) and is complete in a few milliseconds.

The heat generated by the NanoFoil® reflows the solder layers on the backing plate and the target and a bond is instantly formed. The bond is stress-free since the backing plate and target experience little heating during the bonding operation. Strengths of 3000 - 4000 PSI are typical. Bond coverage is between 95% and 99%.