Bonding of Sputter Targets - Peformance Data
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Performance Data
Significant testing, both laboratory and live application, has been performed to support the benefits of NanoBond® in the most rigorous applications. Summary of sputtering trials (all targets bonded to Cu backing plate).
Target Material |
Bond Type |
Power Mode |
Cooling |
Bond Area |
Max. Power without Failure (W) |
Power Density (W/cm2) |
Indium Tin Oxide |
InSn-Revlow |
DC |
Indirect |
3” Diameter |
200 |
4.4 |
Indium Tin Oxide |
Elastomer |
DC |
Indirect |
3” Diameter |
300 |
6.6 |
Indium Tin Oxide |
In Reflow |
DC |
Indirect |
3” Diameter |
335 |
7.3 |
Indium Tin Oxide |
NanoBond® |
DC |
Indirect |
3” Diameter |
460 |
10.1 |
Alumina |
Elastomer |
RF |
Indirect |
3” Diameter |
300 |
6.6 |
Alumina |
NanoBond® |
RF |
Indirect |
3” Diameter |
400* |
8.8* |
Quartz |
NanoBond® |
RF |
Indirect |
3” Diameter |
400* |
8.8* |
TiC |
NanoBond® |
DC |
Indirect |
3” Diameter |
400 |
8.8 |
Boron Carbide |
In Reflow |
DC |
Indirect |
25” x 6” |
2000 |
2 |
Boron Carbide |
NanoBond® |
DC |
Indirect |
25” x 6” |
4000* |
4* |
Residual Stress Calculations
FEA modeling of conventional and NanoBond® joints. The deflection and residual stress are an order of magnitude lower with NanoBond®.
NanoBond® Maximum deflection - 0.04mm over 150mm
Conventional Bond Maximum deflection - 0.7mm over 150mm
The temperature profile during NanoBond® joining at the moment of solder solidification is shown here.
