Joining Markets and Applications
- Large-area Joining
For applications including armor mounting, structural joining (such as auto frames) and joining of sputtering targets.
Specific benefits include:
- Bonding of similar or dissimilar materials (such as ceramics to metal).
- Lower Stress.
- No damage to the materials being joined.
- Room temperature bonding.
- Small-area Joining
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For applications including Thermal Interface Material, component mounting and sealing.
Specific benefits include:
- Bonding of similar or dissimilar materials (such as ceramics to metal).
- Lower Stress.
- Localized heating.
- Higher thermal conductivity.
- Room temperature bonding.
- Works with any solder.
- Flux-free
Learn More
- metallic bonding of ceramic armor using reactive multilayer foils
- Read our latest data including thermal cycling results
- Read about the thermal behavior of a soldered Cu-Si Interface co-written with Aavid Thermalloy
- Read about the thermal performance of a heat sink to IC package Interface co-written with Teradyne
- Read about mounting of microelectronic components co-written with Agilent
Reactive NanoTechnologies, Inc.
- Address
- 111 Lake Front Dr.
- Hunt Valley, MD 21030
- Contact Info
- Phone: 410-771-9801
- Fax: 410-771-0586