Applications
Once activated, the intermixing of the metal layers within RNT’s patented NanoFoil® generates local heat. This heat can be used to melt adjoining solder layers and bond components together without subjecting the entire assembly to temperatures over the melting point of the solder.
NanoFoil® is available in a variety of thicknesses and compositions to provide a range of reaction velocities, temperatures and energy suitable for numerous applications. Applications which can benefit from the advantages of NanoFoil® include; Sputter Target Bonding, Large Area Bonding, Electronics Assembly, Thermal Management and Energetics.
Bonding of Sputter Targets
NanoBond® is RNT’s patented process for joining, utilizing NanoFoil®. This process enables high strength, high conductivity bonds between most combinations of materials making it ideal for bonding materials with large CTE mismatch, including Sputter Targets.
Electronics Assembly
NanoFoil® also offers a localized heat source for bonding components which minimizes exposure to high process temperatures and is compatible with all solders including RoHS compliant, Pb free solders.
- LED Assembly
- Circuit Assembly
- Thermal Management
- Package Bonding
- Connectors
Development Solutions
Taking advantage of the inherent nature of NanoFoil®, RNT continues to develop successful energetic applications.
- Propellant Ignition
- IR Countermeasures
- Delays
RNT Services
- Manufacture and Supply of NanoFoil®
- Applications Engineering and Support
- Sputter Target Bonding Service
- Process Equipment Engineering and Consulting
- Licensing and Training